A6 CPU BGA Stencil iPhone 5 Bottom Layer IC Reballing Chip Pins Soldering Direct Heating Template Tin Plant Steel Net P3014 | Инструменты

A6 CPU BGA Stencil iPhone 5 Bottom Layer IC Reballing Chip Pins Soldering Direct Heating Template Tin Plant Steel Net P3014 | Инструменты

Description: A6 CPU BGA Stencil iPhone 5 Bottom Layer IC Reballing Chip Pins Soldering BGA Direct Heating Template Tin Plant Steel Net P3014

Function: Reballing IC pins

Product Image:

Delivery Time:

Aliexpress Standard Shipping (Post): 10-25 days

DHL:3-5days

FEDEX:4-6days

UPS:3-5days

EMS:7-10days

Package : All the items are new,we pack each item with plastic sealable bag that wrapped with bubble bag,and put in the hard box to ensure the safety of goods during the shipment.

Please kindly note that some of the items are quite small,please be careful when you unpack your parcel,in case they are missing or misplacing.

Notice:  If you receive a defective or incorrect item inside the parcel,please contact us,we'll do our best to solve problem and make you satisfied.

If you have any trouble when using the item,please do not hesitate to ask us for help.

Contact us:   If you have any question,please contact us via email or Trademanager.Please don't discouraged if your email is not answered during non-business hours.Once receiving your email,we will get back to you as soon as possible.

Feedback: We will highly appreciated if you leave 5 stars and positive feedback to us after the purchase. Please do not leave negative feedback before you contact us.If you have any question,please contact us first,we would try our best to solve the problems in time.